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GS450

Our Competitive Edges of 3D SPI

• Programmable Structured Grating PMP Imaging Technology [PATENTED]

• High and low exposure technology; D-Lighting [PATENTED]

• RGB Tune Active 2D Lighting Source [PATENTED]

• Multi-Head Optical Source Technology [PATENTED]

• High-resolution lmage Processing System

• 5 Minutes AI Programming and One-Click Operation

• MES Intelligent Manufacturing Access Capability

• Z-axis Dynamic Compensation+Telecentric Lens for Static Compensation

• Mark Detection, Detection of Moving Bad Marks, and Closed-loop Control

Competitive Edges - Programmable Structured Grating PMP Imaging Technology [PATENTED]

Phase modulation profilometry (PMP) is used to achieve 3Dmeasurement of precision printed solder paste, which greatlyimproves the measurement accuracy while ensuring high-speed measurement.


Phase modulation profilometry (PMP), also known as phaseshift profilometry (PSP), is a method based on sinusoidalstructure grating projection, discrete phase shift to obtainmultiple deformed light field images, and then calculate thephase distribution according to the multi-step phase shiftmethod, and finally use triangulation and other geometricmethods to obtain high-precision height, area, and volume measurement results.

Programmable Structured Grating PMP Imaging Technology

Programmable structured grating PMP imaging technology (PSLM PMP) uses German PSLM components with internationalcutting-edge technology. [Ten-year free warranty]


The object under inspection is sampled 8 times to ensure the high repeatability and accuracy of the equipment detection.

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Programmable Structured Grating PMP Imaging Technology
Example of the PMP phase modulation profilometry technology principle

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Competitive Edges - High and low exposure technology; D-Lighting [PATENTED]

The white light source used by conventional SPI will not affect the color of the PCB, but for black (Dark PCB) and high brightness PCB boards (ceramic PCB), since the reflection degree of these two PCBs to the structured grating is different from that of ordinary PCBs, darker images will be displayed during imaging. Data accuracy is affected and false alarms will increase significantly.


The D-Lighting technology used by S-Tech uses 4 photos in a group of 8 sampled photos, using high exposure mode and low exposure mode respectively. In the setting software, you can choose black, normal, and high brightness options. Perfectly handle PCB boards with different reflectivity and different colors.

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RGB Tune Active 2D Lighting Source
Through RGB TUNE effective filtering of solder paste, white lines, and debris, false judgments of solder paste bridging can be perfectly resolved.

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RGB Tune Active 2D Lighting Source
Through the photos taken by 2D light source, filter the R G B colors separately and capture the colors we need. Such as solder paste, pads, white wires, etc.product-detail-img7.png
Competitive Edges- Multi-Head Optical Source Technology [PATENTED]

he unique Multi-Head optical source technology has obtained a national invention patent and uses 3 different colors of structured light to detect solder pastefrom different angles with an interval of 120°.


Flexible configuration to meet customer needs, optional single head, double head or multi-head.


Compared with the traditional white structured grating alternately taking pictures, Multi-Head can take pictures in multiple directions at the same time, which improves the detection speed.

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Technology PlatformStandard TYPE-B/C
SeriesGS
ModelGS450
Measurement Principle3D white light PSLM PMP (Programmable Spatial Light Modulation, Phase Measurement Profilometry)
MeasurementsVolume, Area, Height, XY Offset, Shape
Detection of Non-Performing TypesMissing print, Insufficient solder paste, Excessive solder paste, Bridging, Offset, Mal-shapes, Surface contamination, etc.
Camera Pixel5M(12M.19M,21M optional)
Lens Resolution3um/16um (4.5um - 20um optional)
XY Accuracy±10um
Repeatability≤1μm (4 Sigma); volume/area:<1%(4 Sigma)
Gage R&R<10%
Inspection Speed0.35sec/FOV ~ 0.5sec/FOV (According to the actual configuration)
Quantity of Inspection Head1 (2.3 optional)
Mark-point Detection Time0.3sec/piece
Maximum Measuring Head±550um (±1200um optional)
Maximum Measuring Height of PCB Warp±5mm
Minimum Pad Spacing100μm (Pad height of 150 μm as reference); 80μm/100μm/150μm/200μm (Determined by actual configuration)
Minimum element01005(03015/008004 optional)
Maximum Loading PCB Size(X*Y)460x490mm(GS450)
Conveyor SetupFront orbit (Back orbit optional)
PCB Transfer DirectionLeft to right or Right to left
Conveyor Width AdjustmentManual & Automatic
Engineering StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImportSupport Gerber format (274x,274d), Manual teaching model;CAD X/Y,Part No.,Package Type input
Operating System SupportWindows 10 loT Enterprise (64 bit)
Equipment Dimension and WeightW1000xD1150xH1530,965Kg(GS450)
OptionalOne person controls more machines, Network SPC (Software only), 1D/2D Barcode scanner, Offline programming software, UPS continuous power supply