EN

GA450

Our Competitive Edges of 3D AOI

• Programmable Structured Grating PMP Imaging Technology [PATENTED]

• AI Intelligent Seamless “Jigsaw” Technology[PATENTED]

• AI Automatic Programming Technology [PATENTED]

• AI Algorithm Technology [PATENTED]

• Enhanced Super RGB Pro 2D Light Source [PATENTED]

• 4/8 Projection Head Optical Source Technology [PATENTED]

• 15 Minutes AI Programming and 20~30 Minutes Fine Tuning Operation

• High-frame CXP Camera Solutions

• 3D+2D Ontology Localization Technology

• Self-developed MES Intelligent Manufacturing Access Capability

• Self-developed SPC Analysis Software & Closed-loop Control

Competitive Edges - Programmable Structured Grating PMP Imaging Technology [PATENTED]

Programmable structured grating PMP imaging technology (PSLM PMP) uses German PSLM components with international cutting-edge technology.  [Ten-year free warranty]

Unique setup of the projection head optical source inspection.  

Programmable Structured Grating PMP Imaging Technology
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Programmable Structured Grating PMP Imaging Technology

The equipment utilizes the programmable structured grating technology to intelligently switch between fine stripes and high wide-range stripes, driving phase shift errors towards zero. With no mechanical transmission components and no wear, it significantly enhances the equipment’s detection capabilities and scope of application.

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Competitive Edges - 4/8 Projection Head Optical Source Technology [PATENTED]

3D AOI uses optional 4+8 projection heads with PSLM multi-frequency projection capability to achieve the best inspection solution, covering all SMT/PTH/Semiconductor Applications. 

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Competitive Edges - AI Intelligent Seamless “Jigsaw” Technology [PATENTED]

The problems of uneven images, uneven colors, and image distortion at the joints of FOV and FOV of typical AOI. 

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AI Intelligent Seamless “Jigsaw” Technology

3D AOI uses innovative AI intelligent seamless “jigsaw” technology to achieve a level that is indistinguishable to the naked eyes. It perfectly solves the problems of unevenness, unevenness, distortion, etc. in the FOV image “jigsaw’ seams of traditional AOI. It improves the positioning accuracy of the detection frame and reduces program debugging time.

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Competitive Edges - AI Automatic Programming Technology [PATENTED]

3D AOI uses intelligent program editing methods and template-based parameter setting methods to facilitate quick programming and debugging.

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Competitive Edges – AI Algorithm Technology [PATENTED]

3D AOI uses AI algorithm to perform one of its detection capabilities to inspect IC pins height. The actual height of the pin is measured purely in 3D mode and compared with the standard threshold to confirm whether it is a fault.  

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AI Algorithm Technology

Another example of AI algorithm to perform resistor color code detection.  

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Competitive Edges - Enhanced Super RGB Pro 2D Light Source [PATENTED]

3D AOI adopts the self-developed enhanced multi-angle, multi-area, modulatable RGB+W+coaxial 2D light source design. It is suitable for the inspection of components, solder joints and text in various situations.  

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3D AOI adopts the self-developed enhanced multi-angle, multi-area, modulatable RGB+W+coaxial 2D light source design. It is suitable for the inspection of components, solder joints and text in various situations.

Gem Vision 3D AOI versus Other typical 3D AOI

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Enhanced Super RGB Pro 2D Light Source
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Technology PlatformStandard TYPE - C 
SeriesGA
ModelGA450
Measurement PrincipleSine white projection PMP inspection
MeasurementsMissing print, Offset, Rotation, Three-dimensional polarity, Upside down, OCV, Side standing, Tombstone, Poor soldering, etc.
Detection of Non-Performing TypesSolder tip, Solder volume percentage, Excessive solder, Insufficient solder, Bridge, Hole plugging, Solder filet, Pad contamination, etc.
Camera Pixel12M(19M, 21M  optional)
Lens Resolution12M 12μm(12M 10μm/15μm  optional;  21M 4μm~12μm  optional)
XY AccuracyXY (Resolution) ±10μm
Repeatabilityheight:  ≤1μm  (4 Sigma); volume/area:<1%(4 Sigma)
Gage R&R<10%
Inspection Speed

0.45sec/FOV~0.65sec/FOV(According to the actual configuration)

Quantity of Inspection Head4  (8 optional)
Mark-point Detection Time'0.5sec/piece
Maximum Measuring Head10mm(25mm  optional)
Maximum Measuring Height of PCB Warp±5mm
Minimum Pad Spacing100μm (Pad height of 150 μm as reference); 80μm/100μm/150μm/200μm (Determined by actual configuration)
Minimum element01005(03015/008004 optional)
Maximum height of element on PCB40mm
Maximum Measuring Height of PCB Warp  ±5mm
Minimum element'01005
Maximum Loading PCB Size(X*Y)450x460 (GA450)
Conveyor SetupFront orbit (Back orbit  optional)
PCB Transfer DirectionLeft to right or Right to left
Conveyor Width Adjustment Manual & Automatic
Engineering StatisticsSPC: Production Trend;  Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability Data;AOI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImportSupport Gerber format (274x,274d), Manual teaching model,  CAD X/Y import
Operating System SupportWindows 10 loT Enterprise (64 bit)
Equipment Dimension and WeightW1000xD1174xH1550, 985Kg(GA450)
Optional1D/2D Barcode scanner, Badmark function, Three-point functions; Offline programming; Repair station